TSMC: N2 To Start With Just GAAFETs, Add Backside Power Delivery Later
When TSMC initially introduced its N2 (2 nm class) process technology earlier this month, the company outlined how the new node would be built on the back of two...
16 by on 6/29/2022
TSMC to Customers: It's Time to Stop Using Older Nodes and Move to 28nm
We tend to discuss leading-edge nodes and the most advanced chips made using them, but there are thousands of chip designs developed years ago that are made using what...
20 by on 6/29/2022
As HPC Chip Sizes Grow, So Does the Need For 1kW+ Chip Cooling
One trend in the high performance computing (HPC) space that is becoming increasingly clear is that power consumption per chip and per rack unit is not going to stop...
40 by on 6/27/2022
TSMC to Expand Capacity for Mature and Specialty Nodes by 50%
TSMC this afternoon has disclosed that it will expand its production capacity for mature and specialized nodes by about 50% by 2025. The plan includes building numerous new fabs...
13 by on 6/16/2022
TSMC Unveils N2 Process Node: Nanosheet-based GAAFETs Bring Significant Benefits In 2025
At its 2022 Technology Symposium, TSMC formally unveiled its N2 (2 nm class) fabrication technology, which is slated to go into production some time in 2025 and will be...
24 by on 6/16/2022
TSMC Readies Five 3nm Process Technologies, Adds FinFlex For Design Flexibility
Taiwan Semiconductor Manufacturing Co. on Thursday kicked off its 2022 TSMC Technology Symposium, where the company traditionally shares it process technology roadmaps as well as its future expansion plans...
44 by on 6/16/2022
Destination 30 TB: HDD Vendors Plan Different Routes to Hit Storage Milestone in 2023
In the recent months all three hard drive manufacturers — Seagate, Toshiba, and Western Digital — and some of their partners have outlined plans to ship 30TB HDDs already...
24 by on 6/3/2022
ASML High-NA Development Update: Coming to Fabs in 2024 - 2025
It took the semiconductor industry over a decade to prep everything needed for production of chips using extreme ultraviolet (EUV) lithography. It looks like it is going to take...
8 by on 5/26/2022
Applied Materials Outlines Next-Gen Tools for 3nm and GAA Transistor Era
Last month Samsung Foundry quietly announced that it was set to begin producing chips using its 3GAE (3 nm-class, gate-all-around transistors, early) process technology in the second quarter. While...
17 by on 5/12/2022
TSMC Roadmap Update: N3E in 2024, N2 in 2026, Major Changes Incoming
Taiwan Semiconductor Manufacturing Co. has solid plans for the next few years, but the foundry's manufacturing technology design cycles are getting longer. As a result, to address all of...
21 by on 4/22/2022
TSMC Unveils N4X Node: Extreme High-Performance at High Voltages
TSMC this week announced a new fabrication process that is tailored specifically for high-performance computing (HPC) products. N4X promises to combine transistor density and design rules of TSMC's N5-family...
42 by on 12/17/2021
Semi CapEx to Hit $152 Billion in 2021 as Market on Track for $2 Trillion by 2035
Semiconductor makers have drastically increased their capital expenditures (CapEx) this year in response to unprecedented demand for chips that is going to last for years. Now the CEO of...
8 by on 12/17/2021
Western Digital Spills Beans on HDD Plans: 30TB HDDs Planned, MAMR's Future Unclear
Western Digital this week said that its energy-assisted magnetic recording (ePMR) and OptiNAND technologies coupled with increased number of platters per hard drive would enable it to build HDDs...
41 by on 12/2/2021
Texas To Get Multiple New Fabs as Samsung and TI to Spend $47 Billion on New Facilities
After a year of searching for the right place of its new U.S. fab, Samsung this week announced that it would build a fab near Taylor, Texas. The company...
135 by on 11/24/2021
TSMC Roadmap Update: 3nm in Q1 2023, 3nm Enhanced in 2024, 2nm in 2025
TSMC has introduced a brand-new manufacturing technology roughly every two years over the past decade. Yet as the complexity of developing new fabrication processes is compounding, it is getting...
32 by on 10/18/2021
TSMC to Build Japan's Most Advanced Semiconductor Fab
Fabs are well-known for being an expensive business to be in, so any time a new fab is slated for construction, it tends to be a big deal &ndash...
14 by on 10/15/2021
China's SMIC To Build a GigaFab for $8.87B: An Answer to the Shortages
As a result of being on the US Entity list, SMIC's blacklisting has caused troubles in the company developing and deploying leading-edge fabrication technologies. As a result, it has...
23 by on 9/6/2021
Samsung: Deployment of 3nm GAE Node on Track for 2022
Samsung Foundry has made some changes to its plans concerning its 3 nm-class process technologies that use gate-all-around (GAA) transistors, or what Samsung calls its multi-bridge channel field-effect transistors...
32 by on 7/9/2021
Seagate Signs HAMR Deal with Showa Denko: Secures Second Source for HAMR Platters
Seagate this week signed an agreement with Showa Denko in a bid to secure a second source of platters for its hard drives based on heat assisted magnetic recording...
17 by on 6/11/2021
TSMC Update: 2nm in Development, 3nm and 4nm on Track for 2022
For TSMC, being the world's largest foundry with nearly 500 customers has its peculiarities. On the one hand, the company can serve almost any client with almost any requirements...
74 by on 4/26/2021
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