Memory
The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had announced v3.0 of the CXL specifications. This was followed by CXL 3.1's introduction at Supercomputing 2023. Having started off as a host to device interconnect standard, it had slowly subsumed other competing standards such as OpenCAPI and Gen-Z. As a result, the specifications started to encompass a wide variety of use-cases by building a protocol on top of the the ubiquitous PCIe expansion bus. The CXL consortium comprises of heavyweights such as AMD and Intel, as well as a large number of startup companies attempting to play in different segments on...
G.Skill Intros Low Latency DDR5 Memory Modules: CL30 at 6400 MT/s
G.Skill on Tuesday introduced its ultra-low-latency DDR5-6400 memory modules that feature a CAS latency of 30 clocks, which appears to be the industry's most aggressive timings yet for DDR5-6400...
2 by Anton Shilov on 8/13/2024
Samsung Shrinks LPDDR5X Chips by 9%, Now Just 0.65mm Thick
Samsung is announcing today that it has begun mass production of 12 GB and 16 GB LPDDR5X modules in the industry's thinnest package. Samsung's shrunken memory packages measure approximately...
7 by Anton Shilov on 8/5/2024
Micron Ships Denser & Faster 276 Layer TLC NAND, Arriving First In Micron 2650 Client SSDs
Micron on Tuesday announced that the company has begun shipping its 9th Generation (G9) 276 layer TLC NAND. The next generation of NAND from the prolific memory maker, Micron's...
4 by Anton Shilov on 7/31/2024
JEDEC Plans LPDDR6-Based CAMM, DDR5 MRDIMM Specifications
Following a relative lull in the desktop memory industry in the previous decade, the past few years have seen a flurry of new memory standards and form factors enter...
19 by Anton Shilov on 7/23/2024
Samsung Validates LPDDR5X Running at 10.7 GT/sec with MediaTek's Dimensity 9400 SoC
Samsung has successfully validated its new LPDDR5X-10700 memory with MediaTek's upcoming Dimensity platform. At present, 10.7 GT/s is the highest performing speed grade of LPDDR5X DRAM slated to be...
0 by Anton Shilov on 7/17/2024
Micron Expands Datacenter DRAM Portfolio with MR-DIMMs
The compute market has always been hungry for memory bandwidth, particularly for high-performance applications in servers and datacenters. In recent years, the explosion in core counts per socket has...
5 by Ganesh T S on 7/16/2024
Kioxia's High-Performance 3D QLC NAND Enables High-End High-Capacity SSDs
This week, Kioxia introduced its new 3D QLC NAND devices aimed at high-performance, high-capacity drives that could redefine what we typically expect from QLC-based SSDs. The components are 1...
6 by Anton Shilov on 7/5/2024
Micron: U.S. Fabs Will Start Operating in 2026 - 2029
When Micron announced plans to build two new fabs in the U.S. in 2022, the company vaguely said both would come online by the decade's end. Then, in 2023...
2 by Anton Shilov on 6/27/2024
CUDIMM Standard Set to Make Desktop Memory a Bit Smarter and a Lot More Robust
While the new CAMM and LPCAMM memory modules for laptops have garnered a great deal of attention in recent months, it's not just the mobile side of the PC...
26 by Ryan Smith & Anton Shilov on 6/21/2024
SK hynix: GDDR7 Mass Production To Start in Q4'2024
Update 06/13: SK hynix has sent a note to AnandTech clarifying that the company "plans to start mass production of GDDR7 in the fourth quarter of this year when...
2 by Anton Shilov on 6/11/2024
Micron's GDDR7 Chip Smiles for the Camera as Micron Aims to Seize Larger Share of HBM Market
UPDATE 6/12: Micron notified us that it expects its HBM market share to rise to mid-20% in the middle of calendar 2025, not in the middle of fiscal 2025. For...
15 by Anton Shilov on 6/7/2024
G.Skill Demonstrates DDR5-10600 Memory Modules On Ryzen 8500G System
Ultra-high performance memory modules are a staple of of Computex, and it looks like this year G.Skill is showing off the highest performance dual-channel memory module kit to date...
7 by Anton Shilov on 6/5/2024
TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes
Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from...
1 by Anton Shilov on 5/16/2024
Micron Ships Crucial-Branded LPCAMM2 Memory Modules: 64GB of LPDDR5X For $330
As LPCAMM2 adoption begins, the first retail memory modules are finally starting to hit the retail market, courtesy of Micron. The memory manufacturer has begun selling their LPDDR5X-based LPCAMM2...
13 by Anton Shilov on 5/8/2024
SK hynix Reports That 2025 HBM Memory Supply Has Nearly Sold Out
Demand for high-performance processors for AI training is skyrocketing, and consequently so is the demand for the components that go into these processors. So much so that SK hynix...
6 by Anton Shilov on 5/2/2024
Samsung Starts Mass Production of 9th Generation V-NAND: 1Tb 3D TLC NAND
Samsung Electronics has started mass production of its 9th generation of V-NAND memory. The first dies based on their latest NAND tech come in a 1 Tb capacity using...
2 by Anton Shilov on 4/23/2024
JEDEC Extends DDR5 Memory Specification to 8800 MT/s, Adds Anti-Rowhammer Features
When JEDEC released its DDR5 specification (JESD79) back in 2020, the standard setting organization defined precise specs for modules with speed bins of up to 6400 MT/s, while leaving...
14 by Anton Shilov on 4/22/2024
SK Hynix and TSMC Team Up for HBM4 Development
SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The...
5 by Anton Shilov on 4/19/2024
Samsung Unveils 10.7Gbps LPDDR5X Memory - The Fastest Yet
Samsung today has announced that they have developed an even faster generation of LPDDR5X memory that is set to top out at LPDDR5X-10700 speeds. The updated memory is slated...
6 by Anton Shilov on 4/17/2024
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