Micron Readies 3D QLC NAND-Based Datacenter SSDs for Nearline Storage
Micron has revealed plans to release datacenter-class SSDs based on 3D QLC NAND memory in an effort to compete in the nearline storage market. Briefly announced at a conference...
29 by on 2/12/2018
AMD Readies Ryzen 3 2200GE & Ryzen 5 2400GE APUs with Reduced TDP
AMD is preparing to release low-power versions of its Ryzen APUs with built-in Radeon Vega graphics. The new Ryzen 3 2200GE and Ryzen 5 2400GE chips will have a...
25 by on 2/12/2018
VAIO S Laptops Updated With 8th Gen Core CPUs & TruePerformance to Prolong Turbo Time
VAIO has updated its popular 13-inch VAIO S laptops sold in the U.S. with Intel’s latest 8th Generation Core i5/i7 processors featuring four cores. Besides new CPUs, the systems...
11 by on 2/12/2018
Samsung Begins Mass Production of 256 GB eUFS Devices for Automotive Applications
Samsung has announced that it has started mass production of eUFS 2.1-compatible storage devices for automotive applications. The new 256 GB devices support select UFS 3.0 features for vehicles...
6 by on 2/12/2018
SK Hynix Announces SSDs with 72-Layer 3D NAND ICs, Own Controllers
SK Hynix this week has said it has completed development of its enterprise-grade SSDs based on its 512 Gb 72-layer 3D TLC NAND chips as well as its own...
7 by on 2/8/2018
Patriot Demos Viper M.2 SSDs with Phison E12, Up to 2 TB
In January, Patriot demonstrated its upcoming Viper M.2-branded high-end SSDs. The new drives are powered by Toshiba’s 64-layer BICS 3D NAND flash memory and Phison’s latest PS5012-E12 controller. The...
5 by on 2/8/2018
Intel Adds New Coffee Lake CPUs to Online Database
Intel has recently added eight unannounced desktop Coffee Lake processors to its MDDS (material declaration datasheet) database. Three new chips belong to the Core i3/i5 lineup are targeting mainstream...
11 by on 2/7/2018
FSP’s Liquid-Cooled Power Supply: The Hydro PTM+ 1200W, Only $700, With RGB
FSP this week has announced that its Hydro PTM+ 1200 W/1400 W power supply, featuring a liquid cooling block that was originally demonstrated at Computex 2017, would hit the...
13 by on 2/7/2018
Lenovo Recalls Some ThinkPad X1 Carbon Laptops Due to Potential Overheating
Lenovo this week has began a voluntarily recall of some of its 5th Generation (Kaby Lake, Intel 7000-series) ThinkPad X1 Carbon notebooks because of an unfastened screw that can...
8 by on 2/7/2018
SK Hynix Lists GDDR6 Memory as ‘Available Now’, Publishes Final Specs
SK Hynix has updated its product catalogue and now lists its GDDR6 memory chips as “available now”. In addition, the company published final specifications of its GDDR6 product family...
9 by on 2/6/2018
ATP Launches M.2 NVMe SSDs: 3D MLC, SMI, Extreme Temps, Up to 2.5 GB/s
ATP has introduced its new lineup of SSDs aimed at industrial applications and are designed to withstand harsh environmental conditions, such as extreme temperatures and humidity. The new ATP...
9 by on 2/2/2018
Intel Appoints New CTO, Confirms Establishment of Product Assurance & Security Group
Intel this week named Michael Mayberry its new Chief Technology Officer effective immediately. The new CTO will be responsible for Intel’s global research and technology development efforts. In addition...
19 by on 2/2/2018
Azio Ships Retro Classic Bluetooth Keyboard: Expensive Luxury for Windows & Mac
Azio has started to sell wireless versions of its old-fashioned typewriter-like Retro Classic mechanical keyboard. The devices look the same as their wired brethren and are available in four...
8 by on 2/2/2018
TSMC Starts to Build Fab 18: 5 nm, Volume Production in Early 2020
TSMC last week held a groundbreaking ceremony for its Fab 18 phase 1 production facility. The fab will produce chips using TSMC’s 5 nm process starting from early 2020...
27 by on 1/31/2018
JEDEC Publishes UFS 3.0 Spec: Up to 2.9 GB/s, Lower Voltage, New Features
JEDEC this week published their UFS 3.0 specification, which is intended to bring numerous performance, power and feature set-related improvements to the standard. The version 3.0 of the spec...
20 by on 1/31/2018
NEC 2018 LaVie Note Mobile: Fanless 12.5” Core i7 with 12hr Battery, Under 2 Lbs
This month, NEC has introduced its first 2018 LaVie notebook: The LaVie Note Mobile. The LaVie line is known due to its design philosophy of being lightweight: when we...
32 by on 1/29/2018
SK Hynix’s Product Catalog Lists 16 Gb DDR4 Chips, Opens Doors to 256 GB DIMMs
SK Hynix has recently added single-die DDR4 memory chips featuring 16 Gb capacity to its product catalog. The benefit of the increase in single-die capacity is two fold: not...
14 by on 1/25/2018
Integral Launches 512 GB microSDXC Card: UHC-I, U1, Class 10
Integral Memory has released the industry’s highest-capacity microSDXC memory card that one can buy today. Integral’s new 512 GB microSDXC V10, UHS-I U1 card can store half of a...
23 by on 1/25/2018
Samsung Updates on GDDR6 Portfolio: 8 Gb and 16 Gb at Multiple Speeds
Samsung has issued an update to the GDDR6 announcement earlier this month. The company’s GDDR6 lineup will include chips featuring 8 Gb and 16 Gb capacities as well as...
19 by on 1/25/2018
HGST Ultrastar 7K6 & 7K8 Enterprise HDDs: Up to 8 TB, 9th Gen PMR
This week Western Digital has introduced a new breed of HGST-branded server-class hard drives targeting “mainstream” applications that require 24/7 availability as well as enterprise-grade reliability and performance, but...
2 by on 1/25/2018
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