Memory
The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had announced v3.0 of the CXL specifications. This was followed by CXL 3.1's introduction at Supercomputing 2023. Having started off as a host to device interconnect standard, it had slowly subsumed other competing standards such as OpenCAPI and Gen-Z. As a result, the specifications started to encompass a wide variety of use-cases by building a protocol on top of the the ubiquitous PCIe expansion bus. The CXL consortium comprises of heavyweights such as AMD and Intel, as well as a large number of startup companies attempting to play in different segments on...
Cadence Buys Memory and SerDes PHY Assets from Rambus
In a surprising turn of events, Cadence and Rambus entered into a definitive agreement late last week for Cadence to buy memory physical interface IP and SerDes businesses from...
5 by Anton Shilov on 7/24/2023
Samsung Completes Initial GDDR7 Development: First Parts to Reach Up to 32Gbps/pin
Samsung has announced this evening that they have completed development on their first generation of GDDR7 memory. The next iteration of the high bandwidth memory technology, which has been...
11 by Ryan Smith on 7/18/2023
Micron Expects to Debut GDDR7 Memory in 2024
Micron late on Wednesday revealed plans to introduce its first GDDR7 memory devices in the first half of 2024. The memory is expected to be used by next generation...
12 by Anton Shilov on 6/29/2023
G.Skill's 24GB DDR5-6000 Modules with AMD EXPO Profiles Released
G.Skill has quietly started selling its 24 GB DDR5 memory modules with AMD EXPO profiles for single-click overclocking. G.Skill's Trident Z5 Neo RGB modules are among the first EXPO-profiled...
4 by Anton Shilov on 6/28/2023
SK Hynix Starts Production of 238-Layer 3D NAND: 34% Denser with 2.4 GT/s Interface
SK Hynix announced this week that it had started volume production of its 238-layer TLC NAND memory. The new device promises higher bit density and lower NAND bits cost...
5 by Anton Shilov on 6/8/2023
TeamGroup Announces T-Force Xtreem ARGB DDR5 Memory: Up to DDR5-8266
At Computex 2023, TeamGroup unveiled two additions to its extensive family of memory products. Available with ARGB heatsinks or subtle black non-RGB heatsinks, the TeamGroup T-Force Xtreem DDR5 memory...
5 by Gavin Bonshor on 6/2/2023
Next-Generation CAMM, MR-DIMM Memory Modules Show Up at Computex
Dynamic random access memory is an indispensable part of all computers, and requirements for DRAM — such as performance, power, density, and physical implementation — tend to change now...
4 by Anton Shilov on 6/2/2023
Corsair Unveils Dominator Titanium DDR5 Kits: Reaching For DDR5-8000
Corsair has introduced its new Dominator Titanium series of DDR5 memory modules that will combine performance, capacity, and style. The new lineup of memory modules and kits will offer...
5 by Anton Shilov on 5/30/2023
SK Hynix Publishes First Info on HBM3E Memory: Ultra-wide HPC Memory to Reach 8 GT/s
SK Hynix was one of the key developers of the original HBM memory back in 2014, and the company certainly hopes to stay ahead of the industry with this...
5 by Anton Shilov on 5/30/2023
Micron Expects Impact as China Bans Its Products from 'Critical' Industries
In the latest move in the tit-for-tat technology trade war between the United States and China, on Sunday the Cyberspace Administration of China announced that it was effectively banning...
12 by Anton Shilov on 5/23/2023
Micron to Bring EUV to Japan: 1γ Process DRAM to Be Made in Hiroshima in 2025
Micron this week officially said that it would equip its fab in Hiroshima, Japan, to produce DRAM chips on its 1γ (1-gamma) process technology, its first node to use...
10 by Anton Shilov on 5/19/2023
Samsung Kicks Off DDR5 DRAM Production on 12nm Process Tech, DDR5-7200 in the Works
Samsung on Thursday said it had started high volume production DRAM chips on its latest 12nm fabrication process. The new manufacturing node has allowed Samsung to reduce the power...
18 by Anton Shilov on 5/18/2023
Report: DDR5 RDIMM Production Impacted by PMIC Compatibility Issues
Memory module producers have been shipping unbuffered DDR5 memory modules for desktop and laptop computers running Intel's 12th Generation Core 'Alder Lake' processors in high volumes since September, 2021...
4 by Anton Shilov on 4/26/2023
ASUS Issues Statement on Ryzen 7000X3D Processor Issues, Possible Voltage Issues with AMD EXPO
Yesterday we reported that MSI announced a wave of firmware updates designed to address and alleviate potential issues with users on AM5 using AMD's Ryzen 7000X3D processors with 3D...
8 by Gavin Bonshor on 4/25/2023
SK hynix Now Sampling 24GB HBM3 Stacks, Preparing for Mass Production
When SK hynix initially announced its HBM3 memory portfolio in late 2021, the company said it was developing both 8-Hi 16GB memory stacks as well as even more technically...
1 by Anton Shilov on 4/21/2023
As The Demand for HBM Explodes, SK Hynix is Expected to Benefit
The demand for high bandwidth memory is set to explode in the coming quarters and years due to the broader adoption of artificial intelligence in general and generative AI...
9 by Anton Shilov on 4/18/2023
Samsung Becomes Latest Memory Fab to Cut Production Amidst Post-Pandemic Slump
Following an ongoing slump in demand that has impacted the entire memory industry over the last several months, Samsung this week has become the latest memory foundry to announce...
11 by Anton Shilov on 4/7/2023
Kingston Launches Fury Beast And Fury Renegade DDR5 Memory in White
Kingston Fury, the gaming and high-performance division of Kingston Technology Company, Inc., has expanded the aesthetics of the company's Fury DDR5 memory portfolio. The Fury Beast and Fury Renegade...
17 by Zhiye Liu on 3/28/2023
G.Skill Launches DDR5-8000 CL38 48GB Memory Kit For Raptor Lake CPUs
G.Skill has announced a new, high capacity DDR5 memory kit for Intel's 13th Generation Raptor Lake processors and accompanying LGA1700 platform. The Trident Z5 RGB DDR5-8000 CL38, which features...
8 by Zhiye Liu on 3/13/2023
Cadence Delivers Technical Details on GDDR7: 36 Gbps with PAM3 Encoding
When Samsung teased the ongoing development of GDDR7 memory last October, the company did not disclose any other technical details of the incoming specification. But Cadence recently introduced the...
29 by Anton Shilov on 3/8/2023
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